LCB3566
SOC :RK3566
存储组合 :2+16 GB / 4+16 GB/ 8+32 GB
产品尺寸 :62mm(L)*40mm(W)*8.3mm(H)
产品介绍 :核心模块与底板的连接采用两颗 Amphenol 的 0.8mm pitch 双排120Pin 板对板连接器，并通过 4 颗 M2 的螺丝固定，稳定可靠、易于安装和维护。
| 基本参数 | |
| SOC | RK3566，22nm，四核64位Cortex-A55 |
| GPU | ARM G52 2EE, OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, high quality 2D Graphics Engine build in |
| NPU | The build-in NPU supports INT8/INT16/FP16/BFP16 MAC hybrid operation |
| VPU | 4KP60 H.265/H.264/VP9 video decoder |
| 1080P60 H.264/H.265 video encoder | |
| 8M ISP | |
| DDR | LPDDR4/LPDDR4X，可选1GB/2GB/4GB/8GB(Optional) |
| eMMC | eMMC 5.1，可选8GB/16GB/32GB/64GB/128GB(Optional) |
| 系统 | Android / Ubuntu / Buildroot / Debian |
| 硬件参数 | |
| Camera Interface | Compatible with the MIPI Alliance Interface specification v1.2 |
| Up to 4 data lanes, 2.5Gbps maximum data rate per lane | |
| One interface with 1 clock lane and 4 data lanes | |
| Two interface, each with 1 clock lane and 2 data lanes | |
| Support up to 16bit DVP interface (digital parallel input) | |
| Support ISP block(Image Signal Processor) | |
| Display Interface | RGB/ BT656/BT1120/ MIPI_DSI_V1.2/ LVDS/ HDMI2.0/Edp1.3/ EBC |
| Support dual screen simultaneous | |
| HDR10/HDR HLG/ HDR2SDR/SDR2HDR | |
| 3D-LUT/P2I/CSC/BCSH/DITHER/CABC/GAMMA/COLORBAR | |
| USB Interface | 1 x USB3.0 HOST, 3 x USB2.0 HOST, 1 x USB2.0 OTG |
| PCIe Interface | 1x PCIe2.1 with 1lane |
| SATA Interface | 2 x SATA3.0 |
| Audio Interface | I2S0 with 8 channel TX and RX |
| I2S1 with 8 channel TX and RX | |
| I2S2/I2S3 with 2 channel TX and RX | |
| PDM with 8channel | |
| TDM supports up to 8 channels for TX and 8 channels RX path | |
| Connectivity | Compatible with SDIO 3.0 protocol |
| GMAC 10/100/1000M Ethernet Controller | |
| Four on-chip SPI controllers | |
| Ten on-chip UART controllers inside | |
| Six on-chip I2C controllers | |
| Smart Card with ISO-7816 | |
| Sixteen on-chip PWMs(PWM0~PWM15) with interrupt-based operation | |
| Multiple groups of GPIO | |
| 4 single-ended input channels SARADC with 10bits resolution up to 1MS/s sampling rate | |
| 其他参数 | |
| Operating temperature | 企业级：-20℃~ 70℃ |
| 工业级：-40℃~ 85℃ | |
| PCB interface | B2B，240Pin |
| PCB layers | 8 layers |
| PCB size | L* W *H(mm)：62 *40 * 8.3（PCB 板厚1.6mm） |
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