LCB3399Pro
SOC :RK3399pro
Storage :3+16 GB / 6+16 GB/ 6+64 GB
Size :75mm(L)*55mm(W)*7.8mm(H)
Product :The core module is connected to the baseboard using two Tyco/AMP dual-row 140-pin board-to-board connectors with a 0.8mm pitch, secured with four M3 screws, which ensures stability and reliability, and is easy to install and maintain.
| Basic Parameters | |
| SOC | RK3399Pro, which features a dual-core Cortex-A72 plus quad-core Cortex-A53 processor architecture. |
| GPU | Mali-T860MP4 GPU, supporting various versions of OpenGL ES (1.1/2.0/3.0/3.1), OpenVG 1.1, OpenCL, and DirectX 11. It also supports AFBC (Frame Buffer Compression). |
| NPU | Offers 3TOPS of computational power, supports 8-bit and 16-bit operations, and is compatible with TensorFlow and Caffe models. |
| VPU | Capable of decoding 4K VP9 and 4K 10-bit H265/H264 videos at up to 60 frames per second (fps). It also supports 1080P multi-format video decoding, including WMV, MPEG-1/2/4, and VP8, as well as 1080P video encoding in H.264 and VP8 formats. |
| DDR | Supports LPDDR4/LPDDR4X memory, with options for 3GB or 6GB configurations. |
| eMMC | eMMC 5.1 storage, with options for 16GB, 32GB, 64GB, or 128GB capacities. |
| PMU | RK806 |
| OS | Android / Ubuntu / Buildroot / Debian |
| Hardware Specifications | |
| Camera Interface | Two ISP built-in |
| Dual MIPI-CSI 4 Lane of 1.5 Gbps/Lane | |
| ITU-R BT 601/656 compliant | |
| Maximum input resolution of one ISP is 14M pixels | |
| Display Interface | Two VOP embedded |
| Dual MIPI-DSI 4 Lane of 1.5 Gbps/Lane up to 2560x1600@60fps | |
| eDP1.3 4 Lane of 2.7/1.62 Gbps/lane | |
| DP1.2 4 Lane with HDCP2.2 up to 4kx2k at 60Hz resolution | |
| HDMI2.0 3 Lane with HDCP2.2 | |
| USB Interface | OTG*1，HOST*2，TYPE-C*2 |
| TYPE-C Interface | Dual Type-C PHY with Type-C V1.1 and USB PD2.0 |
| Attach/detach detection and signaling as DFP, UFP and DRP | |
| Support USB3.0 Type-C and DisplayPort 1.2 Alt Mode | |
| Up to 5Gbps data rate for USB3.0 | |
| Up to 5.4Gbps (HBR2) data rate for DP1.2 | |
| Audio Interface | Three I2S/PCM built-in |
| SPDIF supported | |
| Audio resolution from 16bits to 32bits | |
| Sample rate up to 192KHz | |
| Provides master and slave work mode, software configurable | |
| Support 3 I2S formats (normal, left-justified, right-justified) | |
| Support 4 PCM formats (early, late1, late2, late3) | |
| Support two 16-bit audio data store together in one 32-bit wide location | |
| Support 16, 20, 24 bits audio data transfer in linear PCM mode | |
| Connectivity | Compatible with SDIO 3.0 protocol |
| GMAC 10/100/1000M Ethernet Controller | |
| Six on-chip SPI controllers | |
| Five on-chip UART controllers inside | |
| Nine on-chip I2C controllers | |
| Five groups of GPIO (GPIO0~GPIO4), totally have 122 GPIOs | |
| One PCIe port compatible with PCI Express V2.1 and dual operation mode （RC and EP） | |
| Six-channel single-ended 10-bit SAR-ADC up to 1MS/s sampling rate | |
| Other Specifications | |
| Operating temperature | Enterprise level: -20°C to 70°C |
| Industrial level: -40°C to 85°C | |
| PCB interface | B2B(280 Pin 0.8mm Pitch) |
| PCB layers | 10 layers |
| PCB size | L* W *H(mm)：75 *55 * 7.8 |
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