The FD7352S is a Combo chip that supports Wi-Fi 6 and Bluetooth 5.3, integrating on a single chip the full support for the final version of the Wi-Fi 6 Wave2 protocol WLAN MAC, 2T2R WLAN Baseband, and high-performance RF.

The FD7352P is a Combo chip that supports Wi-Fi 6 and Bluetooth 5.3, integrating on a single chip the full support for the final version of the Wi-Fi 6 Wave2 protocol WLAN MAC, 2T2R WLAN Baseband, and high-performance RF.

FD7256S is a highly integrated, low-cost combo module with high-performance and low-power. It supports Wi-Fi 6 and Bluetooth 5.0 protocol, supports Wi-Fi MAC of the final version of Wi-Fi 6 Wave2 protocol, Wi-Fi Baseband of 1T1R, and high-performance RF. It also supports SDIO3.0, HS-UART and PCM interfaces for connection with the main control. This module also supports BT and Wi-Fi to work in coexistence mode. It is suitable for consumer electronics such as IPC, tablet and IOT, and can also be used in fields with high reliability requirements such as industrial interconnection.

The FD7155U is a Wi-Fi 6 & BT 5.0 Combo chip that supports 1 stream of 802.11ax, and simultaneously supports Wi-Fi/Bluetooth FDD and TDD coexistence. It provides external support for SDIO 3.0 and HS-UART interfaces, fully supporting the final version of the Wi-Fi 6 Wave 2 protocol for the WLAN MAC, a 1T1R WLAN Baseband, and a high-performance RF.

The FD7255S is a Wi-Fi 6 & BT 5.0 Combo chip that supports 1-stream 802.11ax and simultaneously supports Wi-Fi/Bluetooth FDD and TDD coexistence. It features external support for SDIO 3.0 and HS-UART interfaces, fully supporting the final version of the Wi-Fi 6 Wave 2 protocol for the WLAN MAC, a 1T1R WLAN Baseband, and a high-performance RF.

The FD7256U is a Wi-Fi 6 & BT 5.0 Combo module that supports a 1-stream 802.11ax solution. It features external support for SDIO 3.0 and HS-UART interfaces, fully supporting the final version of the Wi-Fi 6 Wave 2 protocol for the WLAN MAC, a 1T1R WLAN Baseband, and a high-performance RF.